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氮化感应致n-MOSFETs Si/SiO2界面应力的研究
引用本文:徐静平,黎沛涛,李斌.氮化感应致n-MOSFETs Si/SiO2界面应力的研究[J].电子学报,2000,28(2):49-51.
作者姓名:徐静平  黎沛涛  李斌
作者单位:1. 华中理工大学固体电子学系,武汉,430074
2. 香港大学电机电子工程系,香港,薄扶林道
基金项目:香港大学RGC和CRCG基金
摘    要:本文借助氩离子(Ar^+)背表面轰击技术研究不同氮化处理所导致的n-MOSFETsSi/SiO2界面附近剩余机械应力。结果表明:NH3氮化及N2O生长的氧化物-硅界央附近均存在较大的剩余应力,前者来自过多的界面氮结合,后者来自因为初始加速生长阶段。N2O氮化的氧化物表现出小得多的剩余应力,从而有优良的界面和体特性。

关 键 词:MOSFET  氮化  界面  应力

Study on Nitridation-Induced Residual Stress near Si/SiO2 Interface in n-MOSFETs
XU Jing-Ping,LI Pei-tao,LI Bin.Study on Nitridation-Induced Residual Stress near Si/SiO2 Interface in n-MOSFETs[J].Acta Electronica Sinica,2000,28(2):49-51.
Authors:XU Jing-Ping  LI Pei-tao  LI Bin
Abstract:Residual mechanical stresses near the Si/SiO 2 interface in n MOSFETs induced by different nitridation processings are investigated by means of Ar + backsurface bombardment.The results show that the NH 3 nitridation and the N 2O growth result in larger residual stress,with the former from higher interfacial nitrogen incorporation and the later from its initial accelerated growth phase.However,the residual stress is negligible for N 2O nitrided oxide,indicating that fresh N 2O nitrided oxide itself has excellent interfacial and bulk properties.
Keywords:n-MOSFETs  gate oxide  nitridation  Si/SiO_2 interface  Ar~+ bombardment  stress
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