Cu films formed simultaneously on (111) and (100) NaCl

Copper films were deposited simultaneously in high vacuum on three different monocrystalline NaCl substrates: evaporated (111) NaCl on mica, evaporated (100) NaCl and air-cleaved (100) NaCl. The occurence and microstructure of monocrystalline or polycrystalline copper films were determined by transmission electron microscopy and diffraction as a function of deposition rate R and substrate temperature T. When log R was plotted against 1/T, straight lines could be drawn separating the monocrystalline and the polycrystalline regions. Activation energies for the polycrystalline to monocrystalline transition of Cu films were calculated to be 1.48, 1.22 and 1.27 eV for the (111), evaporated (100) and air-cleaved (100) NaCl substrates respectively. It is shown that these results can be related to the atomistic theory of nucleation by Walton. Moreover, the results indicate that both the binding energy U between a single adatom and a growing oriented cluster and the atomic adsorption energy Q_ad on the substrate surface are proportional to the planar atom densities in the growing cluster and in the substrate surface respectively. It is further shown that while the activation energies for Cu films formed on the two (100) substrate surfaces are about the same, the actual epitaxial temperatures for the same R are significantly different.