Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate |
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| Authors: | Yoshikazu Takaku Komei Makino Keita Watanabe Ikuo Ohnuma Ryosuke Kainuma Yasushi Yamada Yuji Yagi Ikuo Nakagawa Takashi Atsumi Kiyohito Ishida |
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| Affiliation: | (1) Department of Chemical Engineering &; Materials Science, Michigan State University, East Lansing, MI 48824, USA;(2) Department of Chemical &; Materials Engineering, National Central University, 320 Jhongli City, Taiwan;(3) Department of Materials Science &; Engineering, National Taiwan University, Taipei, 106, Taiwan |
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| Abstract: | The Zn-Al(-Cu) eutectic alloys (melting point 381°C) are candidates for use as Pb-free high-temperature solders as a substitute
for Pb-based solders, which are suitable for severe working environments such as the engine room of hybrid vehicles equipped
with an inverter system as well as a heat engine. In this study, the interfacial reaction between Zn-Al(-Cu) alloys and the
Ni substrate during soldering, aging, and thermal cycling was investigated. Semiconductor chips and Ni substrates were soldered
with Zn-Al(-Cu) alloys at various temperatures under a nitrogen atmosphere. The soldered assemblies were then heat-treated
at 200°C and 300°C to examine the microstructural evolution at the soldered interface. The effect of severe thermal cycles
between −40°C and 250°C in air on the microstructure and fracture behavior at the solder joint was investigated. Even after
a 1000-cycle test, the thickness of the Al3Ni2 layer formed at the interface between the Zn-Al-based solder and the Ni substrate, which is responsible for the damage of
the soldered assemblies, was quite small. |
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| Keywords: | Keyword" target="_blank">Keyword Zn-Al-Cu solder Ni substrate interfacial reaction intermetallic compound thermal cycling test |
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