|
|||||
|
|
A Simulation Study of the Stresses in Crystalline Silicon Photovoltaic Laminates during the Soldering and Lamination Processes Along the Longitudinal Direction |
|
| Authors: | Song Wenjian M. Ridhuan Sasi Kumar Tippabhotla Andrew Ah Ong Tay Arief Suriadi Budiman |
| Abstract: | |
| Keywords: | crystalline silicon cell encapsulation stress finite element analysis (FEA) thermomechanical residual stress soldering stress |