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Flexible Electronics: Heat‐Free Fabrication of Metallic Interconnects for Flexible/Wearable Devices (Adv. Funct. Mater. 40/2019) |
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| Authors: | Andrew Martin Boyce S Chang Zachariah Martin Dipak Paramanik Christophe Frankiewicz Souvik Kundu Ian D Tevis Martin Thuo |
| Abstract: | |
| Keywords: | heat‐free solder interconnects liquid metal multimaterial manufacturing undercooled |