EMC awareness for multi chip modules

As more and more complex functions are realized in modern IC designs, there is also an increasing need to design the IC in order to satisfy the Electromagnetic Compatibility (EMC) requirements. Without a proper design, the high operating frequencies of modern integrated circuits often result in high emissions. Due to the cost pressure on mobile phones and other portable devices, shielding on the PCB is avoided and as a result, the electromagnetic emission of integrated circuits must be reduced. This article provides an overview of design methodologies for achieving EMC of devices implemented in systems in package (SiP) technologies. It exhibits the importance to imply EMC issues in the early design phase to reduce electromagnetic emissions.