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Causal modelling of semiconductor fabrication
Affiliation:1. Discipline of Electrical Engineering, Indian Institute of Technology Indore, Indore, M.P. 453552, India;2. Discipline of Biosciences and Biomedical Engineering, Indian Institute of Technology Indore, Indore, M.P. 453552, India;3. BC Photonics Technology Co., Richmond, B.C., Canada;4. Choitram Hospital and Research Centre, Indore, India;1. Divisions of Cardiology and Critical Care Medicine, Ann & Robert H. Lurie Children''s Hospital of Chicago and Department of Pediatrics, Northwestern University Feinberg School of Medicine, Chicago, IL;2. Department of Surgery, Children''s Hospital of Wisconsin, Milwaukee, WI;3. Division of Biostatistics and Epidemiology, Cincinnati Children''s Hospital Medical Center, Cincinnati, OH;4. Critical Care and Cardiorespiratory Department, Great Ormond Street Hospital for Children National Health Service Trust, Royal Brompton and Harefield National Health Service Foundation Trust, London, United Kingdom;5. Department of Pediatrics, Children''s Medical Center of Dallas, University of Texas Southwestern Medical Center, Dallas, TX;6. Department of Cardiology, Division of Cardiovascular Critical Care, Boston Children''s Hospital and Department of Pediatrics, Harvard Medical School, Boston, MA;7. Division of Pediatric Cardiology, Royal Brompton and Harefield National Health Service Trust, National Heart and Lung Institute, Imperial College London, London, United Kingdom;8. The Heart Program, Miami Children''s Health System, Department of Pediatrics, Florida International University Herbert Wertheim College of Medicine, Miami, FL;9. Divisions of Cardiology and Critical Care Medicine, Cinncinnati Children''s Hospital Medical Center, Department of Pediatrics, University of Cincinnati College of Medicine, Cincinnati, OH;1. Universidade de Lisboa-Faculdade de Ciências, IDL, Campo Grande C8, Lisboa1749-016, Portugal;2. SDSIL Lda, ICAT, Campo Grande, Lisboa1749-016, Portugal;1. Pontificia Universidad Católica de Valparaíso, Valparaíso, Chile;2. Departamento de Informática y Automática, UNED, Madrid, Spain;3. Asociación EURATOM/CIEMAT Para Fusión, CIEMAT, Madrid, Spain;1. College of Information Science and Technology, Beijing University of Chemical Technology, China;2. Department of Chemical and Biomolecular Engineering, University of California, Los Angeles, United States;3. School of Energy and Power Engineering, Wuhan University of Technology, China;4. B. John Garrick Institute for the Risk Science, University of California, Los Angeles, United States
Abstract:Semiconductor fabrication is the manufacturing process by which wafers of silicon are turned into integrated circuits. Reasoning about how wafers are affected by fabrication operations is an important aspect in getting computers to aid in the diagnosis of manufacturing faults and in the design of new fabrication processes. Our research has been aimed at characterizing the knowledge needed to construct qualitative, causal models that can support diagnosis and design of the processes by which semiconductors are manufactured. This article presents our models of wafer structure and the operations that are used in semiconductor fabrication, and describes how a domain-independent simulator uses these models to determine how the operations affect the wafer structure. We also demonstrate how the causal dependencies recorded by the simulator can be used to diagnose manufacturing faults. We conclude with a comparison of our method of using discrete, causal models to other methods of modelling semiconductor fabrication.
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