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Al/SiCp陶瓷基复合材料伪半固态触变成形
引用本文:罗守靖,程远胜,杜之明. Al/SiCp陶瓷基复合材料伪半固态触变成形[J]. 特种铸造及有色合金, 2005, 25(1): 13-15
作者姓名:罗守靖  程远胜  杜之明
作者单位:哈尔滨工业大学
基金项目:国家自然科学基金资助项目 (50 3750 35)
摘    要:在粉末冶金的基础上,结合半固态金属加工技术和陶瓷成形的发展,提出陶瓷基复合材料伪半固态触变成形工艺并且以SiCp为基体,A[σ(Al)=30%]为增塑相,通过该工艺成形卫星角框架制件。结果表明,该工艺成形的零件微观组织比较均匀,HV可达6.43Gpa,应变ε约为0.5%,抗拉强度约为300 MPa,为陶瓷复合材料以及高熔点材料在更多领域中的应用起到推进作用。

关 键 词:粉末冶金 伪半固态 触变成形 SiCp 复合材料
文章编号:1001-2249(2005)01-0013-03
修稿时间:2004-04-06

Al/SiCp Ceramic Matrix Composites Thixoforming in Pseudosemi-solid State
Luo Shoujing Chen Yuansheng Du Zhiming. Al/SiCp Ceramic Matrix Composites Thixoforming in Pseudosemi-solid State[J]. Special Casting & Nonferrous Alloys, 2005, 25(1): 13-15
Authors:Luo Shoujing Chen Yuansheng Du Zhiming
Abstract:A new forming method,the ceramic matrix composites thixoforming in pseudo-semi-solid state,was presented based on the powder metallurgy in combination with the semi-solid metal forming and the developing direction of the ceramic forming in the 21st century. The angle-frames were produced by the method with SiC p as the matrix materials and 30Al as the plasticization phase.The results show that the component' microstructure with 6.43 GPa Hv and about 0.5% strain stress as well as about 300 MPa tesile strength is homogeneously formed. It will play a very important role in promoting the application of the ceramic matrix composites and high melt point materials in more fields.
Keywords:Powder Metallurgy   Pseudo-semi-solid   Thixoforming  SiCp Composites
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