化学镀镍铜磷三元合金沉积工艺的研究

为提高化学镀镍的硬度、耐磨及耐蚀性，以拓宽在电子工业中应用，采用在化学镀镍磷合金液中添加适量的铜离子制得镍铜磷三元合金。研究了镍离子与铜离子浓度比、次磷酸钠含量、沉积温度对合金镀层沉积速率的影响，利用Ｓ－５７０扫描电镜和Ｈ－８００透电镀观察了镀层表面形貌和显微组织，通过硝酸腐蚀试验比较了镍磷合金与镍铜镀层的耐蚀性。结果表明，铜的共沉积能明显提高镍磷合金的耐蚀性。

Study of electroless nickel-copper-phosphorus ternary alloy deposition

The purpose of this study was to improve electroless nickel deposits in hardness, wear and corrosion resistance, and extend their application in electronic industry. Electroless nickel-copper-phosphorus ternary alloy deposits were prepared by addition of cupric sulfate in electroless nickel-phosphorus alloy plating bath. The effects of ion ratio of nickel to copper, concentration of sodium hypophosphite and sodium citrate, deposition temperature on alloy deposition rate were studied Morphology and microstructure of the deposits were studied by S-570 scanning electronic microscopy and H-800 transmitting electronic microscopy, and corrosion resistance of electroless nickel-copper-phosphorus alloy deposits were compared with that of nickel-phosphorus alloy deposits by corrosion tests in concentrated nitric acid, with results indicate that electroless nickel-phosphorus alloy deposits are greatly improved in corrosion resistance by codepositing proper amount of copper.