| Ag元素含量对SnAgCuX无铅钎料性能的影响 |
| |
| 引用本文： | 董文兴,唐斌,史耀武,夏志东.Ag元素含量对SnAgCuX无铅钎料性能的影响[J].焊接学报,2009,30(5):21-24. |
| |
| 作者姓名： | 董文兴 唐斌 史耀武 夏志东 |
| |
| 作者单位： | 北京工业大学,材料科学与工程学院,北京,100124 |
| |
| 基金项目： | 国家科技支撑重点项目，中国机械工程学会焊接学会创新思路预研经费资助项目 |
| |
| 摘 要： | 分析了SnAgCuX系无铅钎料中Ag异元素含量的变化对熔化温度、润湿性能的影响,同时研究了时效前和高温时效后钎焊接头的抗剪强度和显微组织,其中X包含Ni,P和Ce三种元素.结果表明,添加微量X元素能够在一定程度上弥补snAgCu钎料中Ag元素含量的降低引起的性能下降.X元素的添加对SnAgCu钎料的熔化温度影响不大,但能改善钎料合金的润湿性能,提高钎焊接头的抗剪强度,并抑制时效引起的接头强度下降.这与微量X元素的添加改善了钎料的显微组织和金属间化合物的形貌有很大的关系.
|
| 关 键 词： | 低银钎料 SnAgCu合金 微量X元素 显微组织 性能 |
| 收稿时间： | 2008/10/20 0:00:00 |
Effect of Ag content on properties of SnAgCuX lead-free solder |
| |
| DONG Wenxing,TANG Bin,SHI Yaowu and XIA Zhidong.Effect of Ag content on properties of SnAgCuX lead-free solder[J].Transactions of The China Welding Institution,2009,30(5):21-24. |
| |
| Authors: | DONG Wenxing TANG Bin SHI Yaowu and XIA Zhidong |
| |
| Affiliation: | School of Materials Science & Engineering;Beijing University of Technology;Beijing 100124;China |
| |
| Abstract: | The effects of Ag content on the melting temperature,wettability and mechanical properties of the soldered joints were investigated.Microstructures and shear strength of SnAgCuX soldered joint were also studied under both as-reflowed and after high temperature aging conditions.X includes Ni,P and Ce element.The experimental results indicate that the addition of trace amounts X element can remedy the decrease in properties of the solders to a certain extent due to the decrease of Ag content.Adding trace amou... |
| |
| Keywords: | low Ag content solders SnAgCu alloy small X element microstructure properties |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
| 点击此处可从《焊接学报》浏览原始摘要信息 |
|
点击此处可从《焊接学报》下载全文 |
