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Effect of thermal cycling on stresses in thin silicon nitride and silicon carbide films |
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| Authors: | C. W. Lim C. C. Toh J. K. Fu K. Lahiri |
| Affiliation: | (1) Division of Materials Engineering, School of Applied Science, Nanyang Technological University, 639798 Singapore, Singapore;(2) Singapore Institute of Standards and Industrial Research, 1 Science Park Drive, 0513 Singapore, Singapore;(3) S. Division of Materials Engineering, School of Applied Science, Nanyang Technological University, 639798 Singapore, Singapore |
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