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Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications
Affiliation:1. Carbon & Light Materials Application Group, Korea Institute of Industrial Technology, 222 Palbok-ro, Deokjin-gu, Jeonju 54853, Republic of Korea;2. School of Advanced Materials Science and Engineering, Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu, Suwon 16419, Republic of Korea;1. Key Lab. for New Type of Functional Materials in Hebei Province, School of Materials Science and Engineering, Hebei University of Technology, Tianjin 300130, China;2. Tianjin HuanOu Semiconductor Material and Technology Co., Ltd., Tianjin 300384, China;3. China Institute of Atomic Energy, Beijing 102413, China;4. No. 18th Research Institute, China Electronics Technology Group Corporation, Tianjin 300384, China;1. Max Planck Institute for Chemical Energy Conversion, Stiftstraße 34-36, 45470 Mülheim an der Ruhr, Germany;2. Fritz Haber Institute of the Max Planck Society, Faradayweg 4-6, 14195 Berlin, Germany;1. L.V. Pysarzhevsky Institute of Physical Chemistry of National Academy of Sciences of Ukraine, 31 Nauky Av., 03028 Kyiv, Ukraine;2. Belarusian State University, Nezalezhnastsi Av. 4, Minsk 220030, Belarus;3. Institute of General and Inorganic Chemistry, National Academy of Sciences of Belarus, Surganova str., 9/1, Minsk 220072, Belarus;4. V.E. Lashkaryov Institute of Semiconductor Physics of National Academy of Sciences of Ukraine, 41 Nauky Av., 03028 Kyiv, Ukraine;1. College of Materials Science and Engineering, Kunming University of Science and Technology, Xuefu RD, Kunming 650093, Yunnan, China;2. College of Physics and Electronic Engineering, Qujing Normal University, Sanjiang RD, Qujing 655011, Yunnan, China;1. Computer System Lab, Department of Computer Engineering, Chosun University, South Korea;2. SoC System Lab, Department of Information and Communication Engineering, Chosun University, South Korea
Abstract:High reliability has become one of the crucial requirements for portable electronic devices, due to the high dependence of their radio frequency (RF) characteristics on the end-user's surroundings. The RF characteristics of screen-printed silver (Ag) circuits were investigated after a steady-state temperature and humidity storage test. A conductive paste containing Ag nanoparticles was screen-printed onto a silicon (Si) substrate and then sintered at 250 °C for 30 min in air. The printed Ag circuits were placed in a chamber at 85 °C/85% relative humidity (RH) for various durations: 100, 300, 500, 1000 h. The microstructural evolution and thickness profiles of the Ag circuits were observed with field emission scanning electron microscopy and α-step, respectively. The oxidation of the printed Ag circuit surface was analyzed with Auger electron spectroscopy. A network analyzer and Cascade's probe system in the frequency range of 40 MHz to 40 GHz were employed to measure the scattering parameters of the Ag circuits. The experimental results showed that the insertion losses at higher frequencies increased with increasing durations of exposure to the 85 °C/85% RH environment, due to the thicker specific layer for oxidation on the circuit surfaces. The oxide layer was the dominant factor affecting the RF characteristics of the screen-printed Ag thin circuits. Therefore, it is essential to control the oxidation of printed circuits for versatile RF applications.
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