Chip package interaction for LED packages |
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| Affiliation: | 1. Department of Electrical and Electronic Engineering, University of Cagliari, Cagliari, Italy;2. Intraspec Technologies, 3 avenue Didier Daurat, 31400 Toulouse, France;3. CNES, 18 avenue Edouard Belin, 31401 Toulouse Cedex 9, France;1. Department of Electrical Engineering, National Chi Nan University, Nantou 54561, Taiwan;2. Institute of Electronics Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan;1. School of Computer Science and Technology, Anhui University, Hefei 230601, China;2. School of Computer and Information, Hefei University of Technology (HFUT), Hefei 230009, China.;3. School of Electronic Science & Applied Physics, HFUT, Hefei 230009, China;4. School of Mathematics, HFUT, Hefei 230009, China;1. Department of Electrical and Electronic Engineering, Universiti Teknologi PETRONAS, 32610 Teronoh, Perak, Malaysia;2. Department of Physics, Kohat University of Science and Technology, Kohat, KPK, Pakistan;3. Department of Electrical Engineering, University of Engineering and Technology, Lahore, Pakistan |
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| Abstract: | Solid-state lightings (SSL) rapidly penetrate the global illumination market because of the energy efficiency and the reliability. The energy efficiency can be easily evaluated but the reliability is not convenient to be estimated. Among several reliability issues, a LED chip level's reliability could be a difficult problem because chip failures related to electromigration phenomenon are hard to be detected in the early stages. In order to remove potential leakage LEDs in modules, additional screening method is necessary to be performed occasionally. In this study, chip package interaction (CPI) for LED packages was investigated in order to estimate stresses of the LED chip in the module level. This methodology would help LED manufacturers to perform a robust design of LED packages in terms of the LED chip reliability. The electromigration is related to metal diffusion, which belongs to a creep phenomenon. As the creep strain is a function of temperature, stress and time, quantifying stresses in the metal layers of the LED die can be useful information for LED manufacturers to make an engineering decision in the early stages of manufacturing. |
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