Enhancement of light-emitting diode reliability using silicone microsphere in encapsulant |
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| Affiliation: | 1. Department of Electrical Engineering, National University of Kaohsiung, Kaohsiung 811, Taiwan, ROC;2. Department of Electronic Engineering, National Kaohsiung Normal University, Kaohsiung 824, Taiwan, ROC;3. National Nano Device Laboratories (NDL), National Applied Research Laboratories, Hsinchu 300, Taiwan, ROC;1. Department of Electronics and Information Systems, University of Ghent, Sint Pietersnieuwstraat 41, 9000 Ghent, Belgium;2. Department of Microelectronics and Computer Science, Lodz University of Technology, Wolczanska 221/223, 90-924 Lodz, Poland;1. State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China;2. Jiangsu Key Laboratory of Advanced Food Manufacturing Equipment & Technology, Jiangnan University, Wuxi 214122, China;1. Department of Electrical Engineering and Information Technology, University Federico II, 80125 Naples, Italy;2. Dipartimento di Elettronica, Informazione e Bioingegneria, Politecnico di Milano, I-20133 Milan, Italy;3. Infineon Technologies AG, Neubiberg 85579, Germany;1. National Institute for Astrophysics, Optics and Electronics-INAOE, Mexico;2. Pontifical Catholic University of Rio Grande do Sul-PUCRS, Brazil |
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| Abstract: | The aim of this study was to prevent the delamination of encapsulant for light-emitting diode (LED) without sacrificing other optical performance. Silicone microsphere was employed to control the properties of shrinkage and hardness of encapsulant during curing process. The effects of microsphere in encapsulant were investigated by using the different concentration of microsphere. After curing reaction, the shrinkage percentage and hardness of both shore A and D encapsulants were reduced and reinforced, as increasing the concentration of microsphere. Despite the addition of microsphere, the LED packages fabricated without/with microsphere showed the similar initial optical efficiencies. It is because the light scattering effect compensated their small difference of refractive indexes between encapsulants and microsphere. Using the silicone microsphere, the improvement of reliability of LED packages could be achieved after 1000 h under condition of temperature (85 °C)/humidity (RH 85%). It is attributed to the synergy effects of shrinkage suppression and hardness improvement. |
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