| 钠硫电池中金属与陶瓷的密封研究 |
| |
| 引用本文： | 曹佳弟 周懿. 钠硫电池中金属与陶瓷的密封研究[J]. 材料科学与工艺, 1997, 5(2): 67-71 |
| |
| 作者姓名： | 曹佳弟 周懿 |
| |
| 作者单位： | 中国科学院上海硅酸盐研究所 |
| |
| 摘 要： | 通过钠硫电池中不锈钢与氧化铝部件的热压封接（ＴＣＢ）研究，详细讨论了该热压封接工艺参数（温度、压力、时间和铝箔厚度）之间相互关系，得出最佳工艺参数区为：Ｔ＝６００￣６２５℃，Ｐ＝２５￣７５ＭＰａ，ｔ＝１５￣３０ｍｉｎ，δ＝０．３￣０．７ｍｍ；最大封接强度为５７．５ＭＰａ；最小泄漏率为１０＾－１１Ｐａｍ＾３／ｓ。实验结果表明，该热压封接是密封连接钠硫电池中金属与陶瓷部件的最有效的途径，其可靠性在钠硫
|
| 关 键 词： | 热压封接 扩散封接 密封 钠硫电池 蓄电池 |
Study on Metal/Ceramic Seals in Sodium Sulfur Cells |
| |
| Cao Jiadi Zhou Yi. Study on Metal/Ceramic Seals in Sodium Sulfur Cells[J]. Materials Science and Technology, 1997, 5(2): 67-71 |
| |
| Authors: | Cao Jiadi Zhou Yi |
| |
| Abstract: | This paper describes the research on thermocompression bond (TCB) consisting of stainless steel/aluminium interlayers/alumina system in sodium sulfur cells. The effects of the bonding parameters of TCB including temperatures, pressures, times and aluminium foil thicknessies as ewll as assessment of quality and examination are discussed in detail. The optimum process of TCB is found. The max. bonding strength is 57.5 MPa and the min. rate of leakage is 10 -11 Pam 3/S. TCB is considered to be the most effective path for joints between metal and ceramic components in sodium sulfur cells. The dulability of TCB has been demostrated in sodium sulfur cells tested for near 20000h. |
| |
| Keywords: | Thermocompression bond Diffusion hond Seal Sodium Sulfur cell |
| 本文献已被 CNKI 维普 等数据库收录！ |
