Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders |
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Authors: | Jeong-Won Yoon Jong-Gun Lee Jong-Bum Lee Bo-In Noh Seung-Boo Jung |
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Affiliation: | (1) School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do, 440-746, Republic of Korea |
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Abstract: | In this study, electrodes on a flexible printed circuit board (FPCB) and rigid PCB (RPCB) were bonded by a thermo-compression
bonding. The surface finishes on the Cu electrodes of the FPCB and RPCB were organic-solderability-preservative and electroless
Ni/immersion Au (ENIG), respectively. Pb-free Sn-3.0 Ag and Sn-3.0 Ag-0.5 Cu solders were used as interlayers. In order to
determine the optimum bonding conditions, such as bonding force, time, and temperature, a 90° peel test of the FPCB-RPCB joint
was conducted. The relationships between the bonding conditions and peel strength were investigated. We successfully accomplished
the thermo-compression bonding of reliable FPCB-RPCB joints by using Sn-Ag and Sn-Ag-Cu interlayers. The thermo-compression
bonding method is a stable and well-controlled process and can produce robust and reliable connections. |
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