选择镀镍金中镀金面积与厚度关系的研究与改善

随着现代电子技术的不断发展,电路板中将有越来越多的镀镍金表面工艺,来满足开关、触点及耐摩擦等方面的要求。图形的分布不均给电路板镀镍金的表面处理带来了诸如金厚度、金表观等难以克服的缺陷。从电镀的原理方面入手,分析造成这些缺陷的原因,并给出相应的解决办法,为以后选择镀镍金为表面处理方式的产品的加工提供一种新的思路与方法。

Research and improvement on plating gold area and thickness in pattern plating nickel and gold

As the development of modern electronic technology,there are more and more PCB which are manufactured with pattern plating nickel and gold to fulfill the requirements of switch,contact,friction and so on.The different plating area that distributed on different sides induces a lot of defects such as thickness and appearance of gold.Starting with the principle of electroplating,this paper analyses the reason and the solution of the defects,and provides a method of manufacturing the PCB that are treated as pattern plating nickel and gold.