首页 | 本学科首页   官方微博 | 高级检索  
     


A modelling and simulation approach for radio frequency (RF) parasitic effects reduction in wafer-level packaging (WLP) of RF-MEMS passive components
Authors:Iannacci  J.
Affiliation:1.Center for Materials and Microsystems (CMM), Fondazione Bruno Kessler (FBK), Via Sommarive, 18, 38123, Trento, Italy
;
Abstract:Microsystem Technologies - RF-MEMS, i.e. micro electro mechanical-systems (MEMS) for radio frequency (RF) passive components, started to make their way into mass-market applications in the...
Keywords:
本文献已被 SpringerLink 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号