A modelling and simulation approach for radio frequency (RF) parasitic effects reduction in wafer-level packaging (WLP) of RF-MEMS passive components |
| |
| Authors: | Iannacci J. |
| |
| Affiliation: | 1.Center for Materials and Microsystems (CMM), Fondazione Bruno Kessler (FBK), Via Sommarive, 18, 38123, Trento, Italy
; |
| |
| Abstract: | Microsystem Technologies - RF-MEMS, i.e. micro electro mechanical-systems (MEMS) for radio frequency (RF) passive components, started to make their way into mass-market applications in the... |
| |
| Keywords: | |
| 本文献已被 SpringerLink 等数据库收录！ |
|
