| Effect of ultrasonic power on wedge bonding strength and interface microstructure |
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| 引用本文： | 王福亮 李军辉 韩雷 钟掘. Effect of ultrasonic power on wedge bonding strength and interface microstructure[J]. 中国有色金属学会会刊, 2007, 17(3): 606-611. DOI: 10.1016/S1003-6326(07)60142-3 |
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| 作者姓名： | 王福亮 李军辉 韩雷 钟掘 |
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| 作者单位： | School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China |
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| 基金项目： | 国家自然科学基金;国家重点基础研究发展计划(973计划) |
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| 摘 要： | During the aluminum wire wedge bonding, the ultrasonic power and bonding strength were obtained. Based on those data, the relationship between ultrasonic power and bonding strength was studied. The results show that： 1） ultrasonic power is affected by ultrasonic power ratio and other uncontrolled factors such as asymmetric substrate quality, unstable restriction on the interface between wedge tool and aluminum wire; 2） when ultrasonic power is less than 1.0 W, increasing ultrasonic power leads to increasing bonding strength and decreasing failure bonding; on the contrary, when ultrasonic power is greater than 1.6 W, increasing power leads to decreasing bonding strength and increasing failure bonding; 3） only when ultrasonic power is between 1.0 W and 1.6 W, can stable and high yield bonding be reached. Finally, the microstructure of bonding interface was observed, and a ring-shaped bond pattern is founded in the center and friction scrape besides the ring area.
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| 关 键 词： | 焊接强度 超声波技术 显微结构 焊接技术 |
| 收稿时间： | 2006-07-25 |
| 修稿时间： | 2006-07-252007-03-28 |
Effect of ultrasonic power on wedge bonding strength and interface microstructure |
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| WANG Fu-liang,LI Jun-hui,HAN Lei,ZHONG Jue. Effect of ultrasonic power on wedge bonding strength and interface microstructure[J]. Transactions of Nonferrous Metals Society of China, 2007, 17(3): 606-611. DOI: 10.1016/S1003-6326(07)60142-3 |
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| Authors: | WANG Fu-liang LI Jun-hui HAN Lei ZHONG Jue |
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| Affiliation: | School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China |
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| Abstract: | During the aluminum wire wedge bonding, the ultrasonic power and bonding strength were obtained. Based on those data, the relationship between ultrasonic power and bonding strength was studied. The results show that: 1) ultrasonic power is affected by ultrasonic power ratio and other uncontrolled factors such as asymmetric substrate quality, unstable restriction on the interface between wedge tool and aluminum wire; 2) when ultrasonic power is less than 1.0 W, increasing ultrasonic power leads to increasing bonding strength and decreasing failure bonding; on the contrary, when ultrasonic power is greater than 1.6 W, increasing power leads to decreasing bonding strength and increasing failure bonding; 3) only when ultrasonic power is between 1.0 W and 1.6 W, can stable and high yield bonding be reached. Finally, the microstructure of bonding interface was observed, and a ring-shaped bond pattern is founded in the center and friction scrape besides the ring area. |
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| Keywords: | bonding strength ultrasoninc power wedge bonding microstructure |
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