| 提高金属化电容器喷金质量探讨 |
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| 引用本文： | 孙风利.提高金属化电容器喷金质量探讨[J].电子元件与材料,2003,22(7):53-54. |
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| 作者姓名： | 孙风利 |
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| 作者单位： | 聊城精工电子有限公司,山东,聊城,252000 |
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| 摘 要： | 金属化电容器端面喷金质量对电容器主要电性能指标——tg,起着决定性的影响。分析了影响金属化电容器端面喷金质量的因素,介绍了提高金属化电容器端面喷金质量的方法及如何检查金属化电容器端面喷金质量。
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| 关 键 词： | 金属化电容器 质量 改进措施 |
| 文章编号： | 1001-2028(2003)07-0053-02 |
Improvement of the Quality of the End Metallized Layer of the Metallized Capacitors |
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| SUN Feng-li.Improvement of the Quality of the End Metallized Layer of the Metallized Capacitors[J].Electronic Components & Materials,2003,22(7):53-54. |
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| Authors: | SUN Feng-li |
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| Abstract: | The quality of the end metallized layer on the metallized capacitors is decisive factor that influences dissipation factor, one of the important electrical characteristics. The important factors that influence the quality of the end metallized layer are analyzed. The methods for improving and checking the quality of the end metallized layer are presented. |
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| Keywords: | metallized capacitors quality improvement |
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