类金刚石薄膜的反应离子刻蚀

为了刻蚀出图形完整、侧壁陡直、失真度小、独立的类金刚石薄膜微器件,反应离子刻蚀是一种有效地刻蚀方法。研究了氧气与氩气的混合气体进行类金刚石薄膜刻蚀的主要工艺参数(刻蚀时间、有无掩膜、氩氧体积混合比、负偏压)。研究结果表明:在相同条件下,刻蚀速率随刻蚀时间变化不大;有无掩膜对刻蚀速率无明显影响;流量一定时,刻蚀速率随氩氧体积比的增大而降低,随负偏压的增大先增大后减小。实验得到最佳刻蚀条件,在此条件下,刻蚀出图形完整、侧壁陡直、失真度小的微器件,并成功制备出"独立"的微齿轮,进行了组装。

Reactive Ion Etching of Diamond-Like Carbon Films

A novel technique has been successfully developed to construct patterns with sub-micron feature size on diamond-like carbon(DLC) films by reactive ion etching.The structures of the patterns were characterized with scanning electron microscope(SEM).The influence of various etching conditions,including etching time,ratio of argon and oxygen,Al mask,and negative bias voltage,on the quality of the reactive ion lithography was studied.The results show that the Ar/O2 ratio and the bias strongly affect the etching rate.For example,at a fixed gas flow rate,the etching rate increases with the increase of the Ar/O2 ratio,and as the bias rises up,the etching rate first increases and then decreases.After a judicious choice of the etching conditions,we succeeded in fabricating a micro-gear with sharp vertical grooves,well-defined features,but little distortion.