| 银包铜粉环氧导电胶的制备、结构与性能 |
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| 引用本文： | 杜亮亮,周震涛,林学好,袁冯福,潘慧铭.银包铜粉环氧导电胶的制备、结构与性能[J].粘接,2010,31(8):38-41. |
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| 作者姓名： | 杜亮亮 周震涛 林学好 袁冯福 潘慧铭 |
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| 作者单位： | 1. 华南理工大学材料科学与工程学院,广东,广州,510640
2. 深圳美信电子有限公司,广东,深圳,518053 |
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| 摘 要： | 为了研制性能优良的导电胶，选用双酚A型环氧树脂作为基体、四乙烯五胺作为固化剂、银包铜粉为导电填料、AA-75作为分散剂，制备了银包铜粉导电胶。使用直流低电阻测试仪测定了导电胶的体积电阻率；用红外光谱对添加不同量固化剂的导电胶进行了分析，用差示扫描量热仪对加入固化剂后的固化反应情况进行了测试。在最佳配比和最佳工艺条件下所制备的导电胶的体积电阻率达到8．9×10^-4Ω·cm。
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| 关 键 词： | 导电胶 环氧树脂 银包铜粉 体积电阻率 |
Preparation, structure and performance of silver-plating copper filled epoxy conductive adhesive |
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| DU Liang-liang,ZHOU Zhen-tao,LIN Xue-hao,YUAN Feng-fu,PAN Hui-ming.Preparation, structure and performance of silver-plating copper filled epoxy conductive adhesive[J].Adhesion in China,2010,31(8):38-41. |
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| Authors: | DU Liang-liang ZHOU Zhen-tao LIN Xue-hao YUAN Feng-fu PAN Hui-ming |
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| Affiliation: | DU Liang-liang1,ZHOU Zhen-tao1,LIN Xue-hao2,YUAN Feng-fu2,PAN Hui-ming1(1.School of Materials Science and Engineering,South China University of Technology,Guangzhou,Guangdong 510640,China,2.Shenzhen Meixin Electronics Co.,Ltd.,Shenzhen,Guangdong 518053,China.) |
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| Abstract: | In this paper,using bisphenol A epoxy resin as the matrix,TEPA as the curing agent,silver-plating copper powder as the conductive filler and AA-75 as the dispersant,the silver-plating copper filled epoxy conductive adhesive was prepared.DC low-resistance tester is used to measure the volume resistivity,infra-red spectrometry is used to characterize the adhesives with different amount of curing agent and differential scanning calorimetry is used to determine the optimal curing reaction temperature.The result... |
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| Keywords: | conductive adhesive epoxy resin silver-plating copper powder volume resistivity |
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