钯镀层结晶状态及焊锡能力研究

研究了电流密度、镀液温度及镀层厚度对磷青铜上钯镀层的焊锡性与润湿平衡的影响。钯镀层的晶粒尺寸随电流密度的增加或温度的升高而变大,但受膜厚的影响不大。镀态下,不同条件下制得的钯镀层具有良好的沾锡能力。不同活性助焊剂的使用也会影响钯镀层的焊锡性能。对于经蒸汽老化后的钯镀层,采用中等活性的松香助焊剂可获得比采用非活性松香助焊剂更好的焊锡性能。

Study on crystal form and solderability of palladium coating

The effects of current density,bath temperature and coating thickness on the solderability and wetting balance of Pd coating electroplated on phosphor-bronze were studied.The grain size of Pd is increased with increasing current density or bath temperature,but is slightly affected by coating thickness.The solderability of as-plated Pd coatings produced under different process conditions is good.The use of fluxes with different activities affects the solderability and wetting balance of Pd coating.The solderability of steam-aged Pd coating with medium-active rosin flux is better than that with non-active rosin flux.