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Formation of Boron‐doped region using spin‐on dopant: investigation on the impact of metallic impurities
Authors:J Jourdan  Y Veschetti  S Dubois  T Desrues  R Monna
Abstract:Investigation on the electrical properties of p+‐doped regions formed by spin‐on‐dopant (SOD) technique was achieved. Using this technique, boron‐diffused regions were formed on both p‐type and n‐type float zone wafers. Homogeneous sheet resistances were obtained for both types of wafers. Bulk properties were investigated by measuring effective carrier lifetime. An iron contamination was observed after the boron diffusion step and interstitial iron concentrations were deduced from lifetime measurements. More investigations proved that the iron was initially present within the SOD film. A phosphorus diffusion allows to remove this bulk contamination, leading to an improvement of effective lifetime values. Nevertheless, the corresponding emitter saturation current density was estimated on n‐type wafers and presented a high value. It is likely that this poor electrical quality is the consequence of a high iron concentration which remains in the diffused region. Some possibilities are suggested to avoid or to limit this contamination. Copyright © 2008 John Wiley & Sons, Ltd.
Keywords:n‐type silicon  spin‐on‐dopant  boron diffusion  Fe
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