| BGA焊点剪切性能的评价 |
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| 引用本文： | 于 洋,史耀武,夏志东,雷永平,郭 福,李晓延.BGA焊点剪切性能的评价[J].稀有金属材料与工程,2009,38(3):468-472. |
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| 作者姓名： | 于 洋 史耀武 夏志东 雷永平 郭 福 李晓延 |
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| 作者单位： | 北京工业大学,北京,100022 |
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| 基金项目： | 国家高技术研究发展计划(863计划)，国家科技支撑重点项目，北京市自然科学基金，北京市属市管高校人才强教计划，高等学校博士学科点专项科研基金 |
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| 摘 要： | 设计了用单个微焊球和两块带焊盘的FR4板焊接而成的搭接接头,研究了不同稀土含量及不同加载速率对接头强度及塑性的影响.结果表明,微量稀土(质量分数＜0.25%)不但能提高焊点的剪切强度,而且可以改善焊点的塑性.而当稀土含量进一步增加时,焊点的强度及塑性均下降.焊点的剪切强度及伸长量随应变速率的增加而增加.通过对焊点显微组织的分析可知,微量稀土可显著细化焊点的显微组织,特别是抑制了钎料内部及界面处金属问化合物的生长,从而改善了焊点的力学性能.对断口形貌的分析同样证明了伸长量随剪切速率增加而增加.
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| 关 键 词： | 微焊球 球栅阵列封装 剪切强度 |
| 收稿时间： | 2008/3/11 0:00:00 |
Evaluation on the Shear Properties of BGA Solder Joint |
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| Yu Yang,Shi Yaowu,Xia Zhidong,Lei Yongping,Guo Fu and Li Xiaoyan.Evaluation on the Shear Properties of BGA Solder Joint[J].Rare Metal Materials and Engineering,2009,38(3):468-472. |
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| Authors: | Yu Yang Shi Yaowu Xia Zhidong Lei Yongping Guo Fu and Li Xiaoyan |
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| Affiliation: | Beijing University of Technology;Beijing 100022;China |
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| Abstract: | In this paper, soldered lap joint specimens were fabricated by a solder reflow process using a Sn-3.8Ag-0.7Cu-xRE (x=0, 0.1wt%, 0.25wt%, 0.5wt%) BGA solder ball on FR4 substrate parts. The effects of rare earth(RE) content and strain rate on the shear properties of soldered lap joint were investigated. The Results show that the addition of minute RE (<0.25wt%) can improve the shear strength and elongation of the lap joint. However, further increasing of RE content would degrade the shear properties of the l... |
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| Keywords: | solder ball ball grid array packaging (BGA) shear strength |
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