| Effect of Bonding Temperature on the Microstructures and Strengths of C/C Composite/GH3044 Alloy Joints by Partial Transient Liquid-Phase（PTLP） Bonding with Multiple Interlayers |
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| 作者姓名： | Xin Zhang Xiaohong Shi Jie Wang Hejun Li Kezhi Li Yancai Ren |
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| 作者单位： | State Key Laboratory of Solidification Processing,C/C Composites Research Center,Northwestern Polytechnical University |
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| 基金项目： | financially supported by the National Natural Science Foundation of China（Nos.51202193 and 51221001）; the Fundamental Research Foundation of Northwestern Polytechnical University（No.GBKY1021）; the‘‘111’’Project（No.08040） |
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| 摘 要： | With the use of Ti/Ni/Cu/Ni multiple foils as interlayer,carbon/carbon(C/C) composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique.The effect of bonding temperature on the microstructures and strengths of the joints was investigated.The results showed that gradient structural multiple interlayers composed of ‘‘C–Ti reaction layer/Ti–Ni intermetallic compound layer/Ni–Cu sosoloid/residual Cu layer/Ni-GH3044 diffusion layer' were formed between C/C composite and GH3044.The shear strength of the C/C composite/GH3044 joint reached the highest value of 26.1 MPa when the bonding temperature was 1,030 °C.In addition,the fracture morphology showed that the fracture mode changed with the increase of bonding temperature.
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| 关 键 词： | 复合材料 粘合温度 键合技术 瞬间液相 高温合金 显微组织 接头 金属间化合物层 |
| 收稿时间： | 2013-07-29 |
Effect of Bonding Temperature on the Microstructures and Strengths of C/C Composite/GH3044 Alloy Joints by Partial Transient Liquid-Phase (PTLP) Bonding with Multiple Interlayers |
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| Xin Zhang Xiaohong Shi Jie Wang Hejun Li Kezhi Li Yancai Ren.Effect of Bonding Temperature on the Microstructures and Strengths of C/C Composite/GH3044 Alloy Joints by Partial Transient Liquid-Phase (PTLP) Bonding with Multiple Interlayers[J].Acta Metallurgica Sinica(English Letters),2014,27(4):663-669. |
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| Authors: | Xin Zhang Xiaohong Shi Jie Wang Hejun Li Kezhi Li Yancai Ren |
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| Affiliation: | State Key Laboratory of Solidification Processing, C/C Composites Research Center, Northwestern Polytechnical University, Xi’an, 710072, Shaanxi, China |
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| Abstract: | With the use of Ti/Ni/Cu/Ni multiple foils as interlayer, carbon/carbon (C/C) composite was bonded to Ni-based superalloy GH3044 by partial transient liquid-phase bonding technique. The effect of bonding temperature on the microstructures and strengths of the joints was investigated. The results showed that gradient structural multiple interlayers composed of “C–Ti reaction layer/Ti–Ni intermetallic compound layer/Ni–Cu sosoloid/residual Cu layer/Ni-GH3044 diffusion layer” were formed between C/C composite and GH3044. The shear strength of the C/C composite/GH3044 joint reached the highest value of 26.1 MPa when the bonding temperature was 1,030 °C. In addition, the fracture morphology showed that the fracture mode changed with the increase of bonding temperature. |
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| Keywords: | Partial transient liquid-phase bonding C/C composite Ni-based superalloy Microstructure Joint shear strength |
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