埋置元件印制电路板的实用化开发

所开发的埋置元件印制电路板技术SIMPACT^TM（System In Module using Passive and Active Component Sembedding Technology）课题之一是以降低成本，在热压工序开发出提高生产效率的工艺技术。具体的就是缩短热压时间及采用分多段压合的工艺，以增加处理量。对抽取的必要参数进行评价，确定标准化的生产工艺。结果是每单位时间内，一台热压机所处理的基板数量，比原来常规工艺处理量能提高18倍。 应用这一技术可以实现SIMPACT的低成本化，同时也在HD-PLC^TM（High Definition Power Line Communication）模块方面的应用进行了开发。

Practical Development of Buried Components Printed Circuit Boards

System In Module using Passive and Actinve Components embedding Technology(SIMPACT), which has been developed by Panasonic, is a kind of technology for embedding passive and active devices in a substrate. The embedded substrate technology is not used commonly yet because of its expensive cost and long development period.We have therefore developed an advanced hot-press process to reduce costs by increasing throughput capacity, because the conventional hot-press process was one of the expensive processes in SIMPACT. We used thermal stress analysis to set important parameters for the process. The throughput capacity of the developed process is 18 times as high as that of the conventional process.This process reduces process costs and enables putting SIMPACT to practical use for a smaller High Definition Power Line Communication (HD-PLC) module.