超微粒金刚石和富勒烯研具创建超平滑表面的研究

制备了超微粒金刚石和富勒烯研磨工具,并分别进行了硅片研磨试验,详细分析了两种材料的研磨特性如表面粗糙度的稳定性、磨料粒度对研磨效果的影响以及研磨材料的显微结构等。试验结果表明,使用0~1/8μm粒度的金刚石研具获得的表面粗糙度值大于使用0~1/4μm粒度金刚石研具的表面粗糙度值,这是因为磨粒被粘结剂覆盖所致。研究结果表明,采用富勒烯研具研磨硅片可获得Ra5nm的超平滑镜面。

Study on Ultra-smooth Surface Created by Diamond and Fullerene Abrasive Tools with Superfine Grains

The diamond and Fullerene abrasive tools with superfine grains were prepared, and the grinding tests on silicon wafer surface was carried out with this two kinds of abrasive tools. The grinding characteristics of two abrasive materials such as the stability of surface roughness, effects of material grain sizes on the grinding results, and microscopic structures of ground materials were analyzed in detail. The test results show that the surface roughness obtained by the diamond wheel with 0-1/8μm grain size is larger than that by the diamond wheel with 0-1/4μm grain size, this is because the abrasive grains was covered by the bond. It is clarified that the ultra-smooth minute surface with roughness of Ra5nm can be obtained with fullerene wheel in polishing of silicon wafer.