| TiB2表面镀铜工艺 |
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| 引用本文： | 张中宝,许少凡.TiB2表面镀铜工艺[J].电镀与精饰,2006,28(6):34-37. |
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| 作者姓名： | 张中宝 许少凡 |
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| 作者单位： | 合肥工业大学,材料科学与工程学院,安徽,合肥,230009;合肥工业大学,材料科学与工程学院,安徽,合肥,230009 |
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| 摘 要： | 利用化学镀覆技术成功在TiB2颗粒表面均匀化学镀覆铜。透射电子显微镜观察表明：通过严格的镀前预处理工艺的优化设计以增加活化点，对传统镀液配方的调整以降低镀速，能够成功地在TiB2颗粒表面镀覆一层铜，从而培强了其和铜基体之间的界面结合力，为TiB2在复合材料领域之中的应用打下了坚实基础。
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| 关 键 词： | 化学镀 TiB2 复合材料 界面结合力 |
| 文章编号： | 1001-3849（2006）06-0034-04 |
| 收稿时间： | 2006-03-20 |
| 修稿时间： | 2006-03-20 |
Technology of Copper Plating on Surface of TiB2 Particles |
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| ZHANG Zhong-bao,XU Shao-fan.Technology of Copper Plating on Surface of TiB2 Particles[J].Plating & Finishing,2006,28(6):34-37. |
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| Authors: | ZHANG Zhong-bao XU Shao-fan |
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| Affiliation: | Department of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China |
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| Abstract: | Because of the wetting property between copper matrix and TiB2 particles being poor, the technology that produces complex powder TiB2/Cu through electroless copper plating was researched. Observation of TEM images shows that by optimizing the pretreatment process before electroless plating to increase activated sites, and adjusting the traditional composition of copper electroless plating bath to decrease electroless plating rate, a layer of continuous copper on surface of TiB2 can be successfully coated. Thus the interracial adhesion between TiB2 and copper matrix of the composite coating can be increased. |
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| Keywords: | TiB2 |
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