| 高密度集成技术与电子装备小型化 |
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| 引用本文： | 毛小红,崔西会,高能武.高密度集成技术与电子装备小型化[J].电子信息对抗技术,2009,24(4):68-71. |
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| 作者姓名： | 毛小红 崔西会 高能武 |
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| 作者单位： | 信息综合控制国家重点实验室,成都,610036 |
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| 摘 要： | 小型化和一体化是未来电子装备的主流发展方向。电子装备的小型化和一体化离不开高密度集成技术，三维芯片堆叠、芯片倒装焊接、高密度多层布线基板和SIP封装等高密度集成技术在国内的研究正在兴起。未来的电子装备不仅仅是由一个个元器件组装而成，而是电路和封装密不可分的一个3D互连系统。
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| 关 键 词： | 小型化 一体化 高密度集成技术 |
High Density Integrated Technologies and Miniature in Electronic Equipment |
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| Authors: | MAO Xiao-hong CUI Xi-hui GAO Neng-wu |
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| Affiliation: | National Information Control Laboratory;Chengdu 610036;China |
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| Abstract: | The miniature and integral become the main development direction of electronic equipment.The miniature and integral of electronic equipment depends on the high density integrated technology.Some high density integrated technologies are developing in domestic,such as three dimension die stack,flip chip,high density multilayer substrate,and system in package and so on.The future electronic equipment will not only consist of elements,but also a three-dimensional interconnecting system with circuit and packagin... |
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| Keywords: | miniature integral high density integrated technology |
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