Strained n-Channel Transistors With Silicon Source and Drain Regions and Embedded Silicon/Germanium as Strain-Transfer Structure

We report the demonstration of 55 nm gate length strained n-channel field-effect transistors (n-FETs) having an embedded Si_1-xGe_x structure that is beneath the Si channel region and which acts as a strain-transfer structure (STS). The Si_1-xGe_x STS has lattice interactions with both the silicon source and drain regions and with the overlying Si channel region. This effectively results in a transfer of lateral tensile strain to the Si channel region for electron mobility enhancement. The mechanism of strain transfer is explained. Significant drive current I_on enhancement of 18% at a fixed off-state leakage I_off of 100 nA/mum is achieved, which is attributed to the strain-induced mobility enhancement. Furthermore, continuous downsizing of transistors leads to higher I_on enhancement in the strained n-FETs, which is consistent with the increasing transconductance G_m improvement when the gate length is reduced.