| 黑陶瓷封装工艺研究 |
| |
| 引用本文： | 母继荣,李书军.黑陶瓷封装工艺研究[J].微处理机,1997(2):22-24. |
| |
| 作者姓名： | 母继荣 李书军 |
| |
| 作者单位： | 电子工业部东北微电子研究所!沈阳110032 |
| |
| 摘 要： | 通过对黑陶瓷封装工艺的研究，得到了理想的封装工艺条件，并建立了一条稳定性好、成品率高的封装工艺线。同时成功地封装了一些型号的电路，性能优异，通过了高可靠封装质量考核。
|
| 关 键 词： | 黑陶瓷 低熔玻璃 共晶粘结 |
A Study on the Packaging Technology of Glass Sealed Package |
| |
| Mu Jirong, Li Shujun, Bai Guangxian.A Study on the Packaging Technology of Glass Sealed Package[J].Microprocessors,1997(2):22-24. |
| |
| Authors: | Mu Jirong Li Shujun Bai Guangxian |
| |
| Abstract: | The packaging technology of glass sealed package was studied in this paper. We obtained ideal packaging conditions and set up a stable processing ling with high yields. Several types of ICs were packaged successfully. The characters of these ICs were excellent and passed the test of high reliable packaging. |
| |
| Keywords: | glass sealed package low melting glass eutectic die attach |
| 本文献已被 CNKI 维普 等数据库收录！ |
