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Effects of hot carrier induced interface state generation insubmicron LDD MOSFET's
Authors:Tahui Wang Chimoon Huang Chou  PC Chung  SS-S Tse-En Chang
Affiliation:Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu;
Abstract:A two-dimensional numerical simulation including a new interface state generation model has been developed to study the performance variation of a LDD MOSFET after a dc voltage stress. The spatial distribution of hot carrier induced interface states is calculated with a breaking silicon-hydrogen bond model. Mobility degradation and reduction of conduction charge due to interface traps are considered. A 0.6 μm LDD MOSFET was fabricated. The drain current degradation and the substrate current variation after a stress were characterized to compare the simulation. A reduction of the substrate current at Vg ≃0.5 Vd in a stressed device was observed from both the measurement and the simulation. Our study reveals that the reduction is attributed to a distance between a maximum channel electric field and generated interface states
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