防溴型环氧树脂电路板热解动力学分析

引言印刷电路板(printed circuit boards,PCBs)作为一种热固性复合材料,被广泛应用于电子元件与电动控制等多种工业领域[1-2]。印刷电路板主要由玻璃纤维、环氧树脂以及多种金属材料组成[3]其中环氧树脂被认为是最难降解回收的废旧塑料之一[4]。

Pyrolysis kinetics of anti-Br printed circuit boards made epoxy resin

Use of anti Br printed circuit boards（PCBs） made epoxy resin is more and more popular and can generate large amount of solid wasteTheir thermo stability and characteristics of pyrolysis reaction including kinetics was investigated in atmosphere of argon using thermo gravimetric(TG)analysis at various hearting rates(5,10,20,30℃·min-1).The kinetic parameters of pyrolysis reaction including activation energy E were determined by Kissinger’s differentiation and Flynn Wall Ozawa’s integration methodsA study by Coats Redfern method indicated that the Valensi equation was a good approximation of the thermal decomposition reaction kinetics, the order of decomposition reaction was 2, the average activation energy E160.62 kJ·mol-1, and the thermal decomposition mechanism function α+(1-α)×ln(1-α).