| INTERACTION BETWEEN Cu AND LIQUID Sn(II)——SEM OBSERVATION OF INTERMETALLIC GROWTH |
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| 作者姓名： | ZHANG Qiyun LIU Shuqi XU Yaping Peking University Beijing China professor |
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| 作者单位： | ZHANG Qiyun;LIU Shuqi;XU Yaping Peking University，Beijing，China professor，Department of Chemistry，Peking University，Beijing，100871，China |
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| 摘 要： | The features of Cu_6Sn_5 growing slowly at lower temperature and growing rapidly up over350℃,and or Cu_3Sn growing at higher temperatures,bave been detailedly observedunder SEM.The increase of Pb content seems to inhibit sequentially the growth ofCu_6Sn_5 in Pb-Sn alloy.
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| 收稿时间： | 1993-08-11 |
| 修稿时间： | 1993-08-11 |
INTERACTION BETWEEN Cu AND LIQUID Sn(II)——SEM OBSERVATION OF INTERMETALLIC GROWTH |
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| ZHANG Qiyun,LIU Shuqi,XU Yaping Peking University,Beijing,China professor,.INTERACTION BETWEEN Cu AND LIQUID Sn(II)——SEM OBSERVATION OF INTERMETALLIC GROWTH[J].Acta Metallurgica Sinica(English Letters),1993,6(8):81-86. |
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| Authors: | ZHANG Qiyun LIU Shuqi XU Yaping Peking University Beijing China professor |
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| Affiliation: | ZHANG Qiyun,LIU Shuqi,XU Yaping Peking University,Beijing,China professor,Department of Chemistry,Peking University,Beijing,,China |
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| Abstract: | The features of Cu_6Sn_5 growing slowly at lower temperature and growing rapidly up over 350℃,and or Cu_3Sn growing at higher temperatures,bave been detailedly observed under SEM.The increase of Pb content seems to inhibit sequentially the growth of Cu_6Sn_5 in Pb-Sn alloy. |
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| Keywords: | Cu liquid Sn Cu_6Sn_5 Cu_3Sn lead wire solderability |
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