介质前后双重臭氧处理实现锗/氧化铪间界面钝化

The physical and electrical properties of a Ge/GeO₂/HfO₂/Al gate stack are investigated.A thin interfacial GeO₂ layer（ 1 nm） is formed between Ge and HfO₂ by dual ozone treatments,which passivates the Ge/high-k interface.Capacitors on p-type Ge substrates show very promising capacitance-voltage（C-V） characteristics by using in situ pre-gate ozone passivation and ozone ambient annealing after high-k deposition,indicating efficient passivation of the Ge/HfO₂ interface.It is shown that the mid-gap interface state density at the Ge/GeO₂ interface is 6.4×10¹¹ cm^-2·eV^-1.In addition,the gate leakage current density of the Ge/GeO₂/HfO₂/Al gate stack passivated by the dual ozone treatments is reduced by about three orders of magnitude compared to that of a Ge/HfO₂/Al gate stack without interface passivation.

Effective interface passivation of a Ge/HfO2 gate stack using ozone pre-gate treatment and ozone ambient annealing