| Sn-Ag-In系焊料的实用化与今后的课题 |
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| 引用本文： | 许宝兴. Sn-Ag-In系焊料的实用化与今后的课题[J]. 印制电路信息, 2005, 0(2): 58-62 |
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| 作者姓名： | 许宝兴 |
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| 作者单位： | 中国电子科技集团公司第二研究所,030024 |
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| 摘 要： | 焊料合金低融点化是实现无铅化的关键技术。经研究表明,Sn-Ag-In系焊料在焊接可靠性方面能够满足要求,有广阔的应用前景。
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| 关 键 词： | 无铅焊料 低融点化 焊接可靠性 |
Practical Use Situation and Problems of the Sn-Ag-In System Solder |
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| Xu Baoxing. Practical Use Situation and Problems of the Sn-Ag-In System Solder[J]. Printed Circuit Information, 2005, 0(2): 58-62 |
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| Authors: | Xu Baoxing |
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| Abstract: | To lower melting point of solder alloys is the key technique to realize lead-free to turn. It was shown by research, the Sn-Ag-In system solder can satisfy the request in soldering reliability, has vast application foreground. |
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| Keywords: | lead-free solder lowering melting point soldering reliability |
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