倒装芯片热电极键合工艺研究

文章将论述一种无掩模制造细小焊料凸点技术。利用热电极键合工艺将带有凸点的倒装芯片焊到基板上。此项工艺能将间距小至40μm的倒装芯片组装到基板上。文章也论述了间距为40μm、电镀AuSn钎料凸点的倒装芯片组装工艺技术。金属间化合物相的形成对焊点可靠性有重要影响，尤其是对于细小焊点。文中研究了金属间化合物相的形成与增加对可靠性的影响。讨论分析了热循环和湿气等可靠性试验结果。

Research on the Thermode Bonding Procee for Flip Chip

In this paper a maskless bumping technique to create thin solder caps will be show. Using a themode bonding process chips can be flip chip mounted on substrates This work is focused on the assembling process of flip chips with pitches down to 40 micron .The flip chip assembling process using electroplated AuSn bumps at 40 micron pitch will also be shown.IntermetaUic phase formation plays an important role for the reliability of solder joints.The effect of intermetallic phase formation and growing on the reliability are studied.Results of reliability test such as thermal cycling and humidity testing are discussed.