Multiple cracks on the interface between a piezoelectric layer and an orthotropic substrate

In the present work, we investigate the problem of multiple cracks on the interface between a piezoelectric layer and an orthotropic substrate. The method of dislocation simulation and singular integral equation are used to solve the crack problem. The theoretical derivation is verified by the classical result in a special case. Numerical results of the stress intensity factor are obtained, and thereby the effects of geometrical parameters and material orthotropy are surveyed. The optimal stiffness ratio of the orthotropic substrate is suggested for the purpose of interfacial fracture prevention, which is significant for the design and assessment of such a kind of smart structures.