面向高密度柔性集成电路封装基板的精密视觉检测算法

高密度柔性集成电路(IC)封装基板是电子组件的核心载体, 其制造过程中的刻蚀、显影等工艺需要严格的品质控制. 本文开发了一种融合金相显微镜与工业相机的成像视觉检测系统, 用于柔性IC封装基板的图像采集与品质控制. 针对显微成像视野小、易离焦等问题, 提出了一种基于中值的三元模式局部纹理快速自动对焦算法. 此外,针对高倍镜下柔性IC封装氧化缺陷分布不均匀问题, 引入微分几何工具, 利用曲率等几何特征提出了一种基于动态曲线演化的高精度表面氧化分布特征检测模型. 通过定性与定量的实验研究, 验证了两种算法在快速性和高精度方面的优越性能.

Precision visual inspection algorithms for high-density flexible integrated circuit packaging substrates

Flexible integrated circuit (IC) packaging substrates with a high density are essential for holding electronic components. Strict quality control is required during their manufacturing operations, which include developing and etching. For the purpose of acquiring images and ensuring the quality control of flexible IC packaging substrates, an industrial camera and metallographic microscope are integrated into an imaging vision inspection system. To address the challenges of narrow field of vision and defocus vulnerability in microscopic imaging, a fast autofocus algorithm for local textures in ternary mode based on median value is proposed. Furthermore, to tackle the uneven distribution of oxidation defects on flexible IC packaging under high magnification, a high-precision surface oxidation distribution feature detection model based on dynamic curve evolution is developed, incorporating differential geometry and utilizing geometric features like curvature. Experimental research, both qualitative and quantitative, confirms the superior performance of both algorithms in terms of speed and accuracy.