Scaling potential of pin-type 3-D SBT ferroelectric capacitors integrated in 0.18 μm CMOS technology |
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Authors: | L. Goux D. Maes H. Vander Meeren L. Haspeslagh G. Russo D.J. Wouters |
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Affiliation: | a IMEC, Kapeldreef 75, B-3001 Leuven, Belgium b STMicroelectronics, MPG Development Center Catania, Stradale Primosole, 95121 Catania, Italy |
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Abstract: | In this work, the difficult scaling of FeRAM is circumvented by fabricating 3-dimensional ferroelectric capacitors stacked on W plugs and successfully integrated in 0.18 μm technology using MOCVD SBT. The effective remnant polarization was increased by 70% due to the sidewall contribution. Also, high reliability of 3-D capacitors was assessed. The samples showed no fatigue degradation after 1013 ±5 V cycles. From extrapolation of both imprint and retention results, a wide sensing window is kept after 10 years in most severe temperature condition, that is at 150 °C. Critical integration issues are discussed for further scaling in 0.13 μm technology and below. |
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Keywords: | Ferroelectric memories 3-D capacitors Scaling SBT MOCVD Reliability testing |
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