| 印制板阻焊塞孔加工技术实验研究 |
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| 引用本文： | 余华,;张文晗,;谢伟力. 印制板阻焊塞孔加工技术实验研究[J]. 印制电路信息, 2014, 0(8): 47-50 |
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| 作者姓名： | 余华, 张文晗, 谢伟力 |
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| 作者单位： | [1]西安徽电子技术研究所,西安临潼710600; [2]伊达斯电子科技有限公司,湖北武汉430073 |
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| 摘 要： | 结合电路板阻焊塞孔工艺技术产品批产化，根据生产线现有设备的实际情况，解决阻焊塞孔印制板加工过程所遇到由于过孔阻焊塞孔不良（空洞及露铜等）而导致锡珠入孔，造成的短路异常风险隐患等各种工艺难题。采用此种工艺制作技术方法均可实现阻焊塞孔印制板产品的批量在线的加工。
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| 关 键 词： | 阻焊塞孔 过孔 先塞后印 阶段性固化 |
Research on the resistance welding and hole clogging technology for printed circuit board |
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| Affiliation: | YU Hua,ZHANG Wen-han,XIE Wei-li |
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| Abstract: | The work of the paper is based on the project of “the batch production of the circuit board with the resistance welding and hole clogging technology”. The existing equipment is faced the short circuit or other fault because the solder ball has been easily fiown into the connection holes for the resistance welding and hole clogging. And the study concluded that this new technological processes has no damage effect on the batch production of PCB. |
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| Keywords: | The Resistance Welding and Hole Clogging Technology Drilling Hole Clogging First and Printing Phase-Curing |
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