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层压板厚控制分析报告
引用本文:刘云洁,;张文晗,;谢伟力.层压板厚控制分析报告[J].印制电路信息,2014(7):24-26.
作者姓名:刘云洁  ;张文晗  ;谢伟力
作者单位:[1]西安微电子技术研究所,西安临潼710600; [2]伊达斯电子科技有限公司,湖北武汉430073
摘    要:从影响层压板厚的基材厚度、PP100%残铜时压合厚度、各内层残铜率、内外层铜箔厚度等各方面经过大量实验准确得出板厚的控制方法,并设计“多层板压合后板厚计算表”,简单输入所需信息后可方便快捷的计算出层间半固化片厚度和压合后最终板厚。方法合理科学,可完全指导实际生产。

关 键 词:层压  压合板厚  残铜率  半固化片

Analysis report of laminate thickness control
Affiliation:LIU Yun-jie, ZHANG Wen-han, XIE Wei-li
Abstract:The thickness control method of the laminate has been accurately obtained through numerous experiments considering several factors such as the substrate thickness, compaction thickness of PP giving the 100% residual rate of copper, the inner residual rate of copper, the copper foil thickness of internal and external layer. And at the same time, the sandwich plate thickness calculation table after pressing has been designed. After simply enter the required information, the half curing slice thickness between the layers and the ifnal thickness after pressing can be efifciently calculated. This method is reasonable and scientiifc which can guide the practical production.
Keywords:Lamination  Bonding Thickness  Residual Rate of Copper  Prepreg
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