| 无机填料分散技术在覆铜板制造中的应用 |
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| 引用本文： | 黄超勇.无机填料分散技术在覆铜板制造中的应用[J].印制电路信息,2014(8):21-25. |
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| 作者姓名： | 黄超勇 |
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| 作者单位： | 陕西生益科技有限公司,陕西咸阳712000 |
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| 摘 要： | 文章通过介绍复合材料中无机填料的分散，填料表面处理，分散设备技术应用等内容，阐述了填料分散技术在覆铜板制造的应用。
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| 关 键 词： | 无机填料分散技术 填料表面改性 填料分散设备 |
The application of inorganic filler dispersion technology in the copper-clad plate manufacture |
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| HUANG Chao-yong.The application of inorganic filler dispersion technology in the copper-clad plate manufacture[J].Printed Circuit Information,2014(8):21-25. |
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| Authors: | HUANG Chao-yong |
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| Affiliation: | HUANG Chao-yong |
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| Abstract: | By introducing the dispersion of inorganic filler, filler surface treatment and dispersion equipment, the application of inorganic filler dispersion technology in the copper-clad plate manufacture was explained. |
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| Keywords: | Inorganic Filler Dispersion Technology Filler Dispersion Equipment |
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