| 一种HDI板对位方式简析 |
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| 引用本文： | 周定忠,李伟保.一种HDI板对位方式简析[J].印制电路信息,2014(2):42-43. |
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| 作者姓名： | 周定忠 李伟保 |
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| 作者单位： | 胜华电子惠阳有限公司,广东惠州516257 |
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| 摘 要： | HDI板的对位精度问题主要涉及有通孔、盲孔与外层干膜的对位偏移问题，板边工具孔作为线路板工序生产必须的定位孔，其精度与对位方式决定线路板的生产精度。文章主要介绍一种HDI板的对位方式，重点解决HDI板通孔与盲孔的对位匹配，从而保证外层的孔环无崩孔问题。
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| 关 键 词： | 高密度互连线路板 工具孔 定位 |
A registration method for HDI board |
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| ZHOU Ding-zhong,LI Wei-bao.A registration method for HDI board[J].Printed Circuit Information,2014(2):42-43. |
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| Authors: | ZHOU Ding-zhong LI Wei-bao |
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| Affiliation: | ZHOU Ding-zhong, LI Wei-bao |
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| Abstract: | HDI board registration accuracy problems mainly related to through-hole, blind hole and outer dry iflm migration problem. Edge tool hole as PCB production process is a must positioning hole, its precision and registration way decide circuit board manufacturing precision. This paper mainly introduces a way of HDI board of registration by solving the key HDI board hole and blind hole matching challenge, thus ensuring the outer grommet hole collapse problem. |
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| Keywords: | HDI Tooling Holes Registration |
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