| 电感器件埋入PCB板的设计原理及加工过程解析 |
| |
| 引用本文： | 黄江波,胡贤金,王一雄. 电感器件埋入PCB板的设计原理及加工过程解析[J]. 印制电路信息, 2014, 0(7): 46-49 |
| |
| 作者姓名： | 黄江波 胡贤金 王一雄 |
| |
| 作者单位： | 深圳市迅捷兴电路技术有限公司,广东深圳518054 |
| |
| 摘 要： | 主要从电感理论计算、PCB资料设计、加工过程三大方面解析电感埋置的技术原理,为电源模块板密集化发展起到抛砖引玉的作用。
|
| 关 键 词： | 电感器件 埋入印制板 设计原理 |
Inductor buried analytical design principle and process of PCB board |
| |
| HUANG Jiang-bo,HU Xian-jin,WANG Yi-xiong. Inductor buried analytical design principle and process of PCB board[J]. Printed Circuit Information, 2014, 0(7): 46-49 |
| |
| Authors: | HUANG Jiang-bo HU Xian-jin WANG Yi-xiong |
| |
| Affiliation: | HUANG Jiang-bo, HU Xian-jin, WANG Yi-xiong |
| |
| Abstract: | This article analyzes the principles and technology of buried inductance mainly from inductanc e theory calculation, PCB layout design and PCB manufacturing process, which play the role of using the little to g et the big about intensive development of power module board. |
| |
| Keywords: | Inductive Devices Embedded PCB Design Principle |
| 本文献已被 维普 等数据库收录！ |
