氰酸酯型覆铜板催化体系的研究

氰酸酯（CE）具有优异的介电性能、耐热性、低吸湿性和良好的加工性，被广泛应用于低介电高速覆铜板（CCL）。研究了过渡金属离子与第二元催化剂共催化氰酸酯环氧体系的固化反应历程，以及第二元催化剂对板材的介电性能等的影响。结果表明第二元催化剂与过度金属离子有明显的协效催化作用，体系反应温度大幅度降低，同时覆铜板介电性能明显提高。

Study on the catalyst system for cyanate ester copper clad laminate

Cyanate ester with excellent dielectric properties, heat resistance, low water absorption and good processability, was widely used in low-loss CCL. This paper studied curing reaction process of the cyanate ester and epoxy by transition metal complex catalyst and assisted catalyst. Then it made research on the CCL dielectric property affected by assisted catalyst. The results showed that assisted catalyst and transition metal complex catalyst have signiifcant synergistic catalytic system. The reaction temperature is signiifcantly reduced. CCL performance, dielectric properties, is remarkably improved.