ECWC13中的PCB基材技术

本文对第13届世界电子电路大会中收录的关于PCB基材技术方面的论文进行了综述：杜邦公司推出了基于高频高速、热量管理及设计方面的新型高频高速挠性板材料Du Pont TM Pyralux TK（TK）及Du Pont TM Pyralux JT（JT）;台湾工研院对于环保材料在CCL的应用中有较深入的研究,并介绍了气相生长碳纤维材料应用于聚酰亚胺挠性板中的研究情况;广州兴森快捷公司对含有热致液晶材料的PCB板的生产参数进行摸索和考察,以验证其在电子电路行业的实际应用;EIPC主席Alun Morgan撰写的关于阻燃剂的论文,则对含卤阻燃剂在行业中的继续应用仍然抱有很大的信心;德国Nabaltec AG公司的Carsten W.IHmels的文章详细介绍了阻燃剂勃姆石在PCB材料中的应用。这些论文展示的一些研究结果,我们可以大概了解到当今PCB基材发展的大致趋势,及一些新型材料的在PCB基材中应用情况。

New studies on PCB materials in ECWC13

This paper introduced the new technologies and developments about PCB materials in ECWC13. Dupont discussed the new trends about high speed/high frequency, thermal management and design flexibility in rigid-flex boards, and introduced the new products DuPontTM Pyralux TK（TK） and DuPontTM Pyralux JT（JT）. Industrial Technology Research Institute（Taiwan） developed an environmentally-friendly material for high frequency and high electronic products, and mixed the polyimide resin, inorganic power and VGCF to produce afiexible thermal conductive substrates of three-layer structure. Fastprint Circuit Tech Co.,Ltd described a series of processing parameters and processing methods about actual production and verifies the TLCP materials products in the production of small batch processing viability. Chairman EIPC Alum Morgan took a critical look at all aspects of fire retardancy, staring with the need for fire safety. Nabaltec AG showed effects when combining metal hydrates and other fillers together with various halogen free, organic fiame retardancy performance, thermal stability, thermal expansion, thermal conductivity, and processability were discussed. We can learn from these papers to know some new materials applied in PCB and the trends in PCB industries.