| 电镀填盲孔取消闪镀直接填铜工艺研究 |
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| 引用本文： | 李志丹,陈世金,胡文广,邓宏喜,李云萍.电镀填盲孔取消闪镀直接填铜工艺研究[J].印制电路信息,2014(12):17-18. |
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| 作者姓名： | 李志丹 陈世金 胡文广 邓宏喜 李云萍 |
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| 作者单位： | 博敏电子股份有限公司,广东梅州514768 |
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| 摘 要： | 文章主要阐述HDI电路板在电镀填孔制作中的一种填铜新工艺，经垂直沉铜后取消闪镀，直接进行填铜。用正交表L16（45）安排不同介质厚度、浸酸时间、浸酸浓度、三因素进行电镀试验，进行综合分析得到了填铜的最佳参数。
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| 关 键 词： | 电镀 盲孔填充 正交设计 |
The study of microvia iflling by direct copper electroplating in PCB |
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| Affiliation: | LI Zhi-dan, CHEN Shi-jin, HU Wen-guang, DENG Hong-xi, YUNPING-LI |
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| Abstract: | This article mainly describes a new hole iflling plating process in HDI PCB which cancel the lfash plating and implement hole iflling process directly after electroless copper plating. This test uses orthogonal experiment and arrange experiment with the L16（45） orthogonal table. Select the thickness of dielectric layer, pickling time, acid concentration as factors, pore-iflling ratio is selected as the experimental electroplating index. After a comprehensive analysis, the optimal parameter is obtained. |
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| Keywords: | Electroplating Microvia Filling Orthogonal Experiment |
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