| 一种无卤型纸基覆铜板制备方法的探讨 |
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| 引用本文： | 陈晓鹏,刘明佩.一种无卤型纸基覆铜板制备方法的探讨[J].印制电路信息,2014(8):12-14. |
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| 作者姓名： | 陈晓鹏 刘明佩 |
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| 作者单位： | 山东金宝电子股份有限公司,山东招远265400 |
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| 摘 要： | 为了适应“无铅制程”和“无卤基板材料”的绿色环保发展趋势，覆铜板行业广大技术人员正不断的研发新型的环保型覆铜板。文章主要从纸基覆铜板树脂胶黏剂的组成--阻燃剂这一方面研究，探讨一种无卤环保纸基覆铜板的制备方法。
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| 关 键 词： | 无卤 覆铜板 环保 树脂胶黏剂 阻燃剂 |
Research on halogen-free paper base CCL preparation method |
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| CHEN Xiao-peng,LIU Ming-pei.Research on halogen-free paper base CCL preparation method[J].Printed Circuit Information,2014(8):12-14. |
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| Authors: | CHEN Xiao-peng LIU Ming-pei |
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| Affiliation: | CHEN Xiao-peng,LIU Ming-pei |
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| Abstract: | In order to meet the green trends of the leadfree manufacturing process and halogen-free materials, the technicians of CCL industry is constantly developing new environment-friendly copper clad laminate. This article is discussing the composition of the paper base CCL resin adhesive and the research progress of the halogen-free paper base CCL, with a focus on fiame retardant. |
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| Keywords: | Non Halogen Copper Clad Laminate Environmental Protection Resin Adhesive Flame Retardant |
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